Heller Pressure Cure Oven
压力烤箱
Heller has developed Pressure Cure Oven（PCO）or Autoclave to minimize voiding and increase adhesion strength for bonding processes typically used in die attach andunderfill applications.PCO pressurizes air into a rigid vessel and heats with forced convection.When the curing process is complete，the pressure oven automatically relieves its pressure to 1atm and cools.
Heller的压力烤箱主要应用于芯片贴装和填胶工艺；可有效消除气泡，增加芯片贴装和填胶的粘着力；采用强制热风对流加热，在密闭容器内加压烘烤；烘烤完成后，自动释放压力，并进行冷却。
Representative Pressure/Temp Profiles (User Configurable)
典型压力／温度曲线（可调节）
