Vertical Curing Dven 垂直烘烤炉 Heller has developed Vertical Curing Ovens for inline applications.By the design of vertical transfer，it is able to save costly floor space and get stable temperature prolfiles. Compared with traditional ovens，vertical curing oven can fulfill the automatic in line production with superior temperature uniformity.Major applications:Die Atach，Flip Chip，Underfill，COB Encapsulation. Heller开发的垂直炉可取代原有的普通烤箱，实现自动化在线烘烤制程；通过特殊的垂直方向传输，可大幅减少占地面积，获得稳定的温度曲线；克服了传统烤箱无法进行自动化生产的缺点，且均温性明显优于传统烤箱；垂直烘烤炉的主要应用包括：芯片贴装，倒装，填胶，COB封装等。 Features主要特点 ·Small Footprint-as small as 185cm占地面积小，总长度仅有185cm ·Fast Curing Time-down to 7.5 minutes可用于快速烘烤，最短烘烤时间仅为7.5分钟 ·Adjustable Curing Times-up to several hours烘烤时间可调，最短几分钟，最长几个小时 ·Adjustable Product Width-from 7.5cm to 35cm产品宽度可调，最小7.5厘米，最大35厘米 ·Air Atmosphere（nitrogen optional） 空气炉 ·SMEMA Compatible兼容SMEMA标准 Heller Vertical Oven Specifications Heller垂直烘烤炉型号与规格 Vacuum Clamp Conveyar 真空夹具 Heller Industries has invented a vacuum clamp that moves within a conveyor belt system inside a horizontal reflow oven.Vacuum clamp carriers return underneath oven from exit to entrance to provide continuous operation.This vacuum clamping design has proved effective for wafer or substrate warpage mitigation. Heller 开发的真空夹具系统，是和配置真空轨道的回流焊设备一体化的整套系统。真空夹具从炉膛入口处到出口处循环运转，自动回收，实现在线式生产。无论是晶圆回流还是基板回流，这套真空夹具都可有效解决产品的板弯板翘问题。
Heller Pressure Cure Oven 压力烤箱 Heller has developed Pressure Cure Oven（PCO）or Autoclave to minimize voiding and increase adhesion strength for bonding processes typically used in die attach andunderfill applications.PCO pressurizes air into a rigid vessel and heats with forced convection.When the curing process is complete，the pressure oven automatically relieves its pressure to 1atm and cools. Heller的压力烤箱主要应用于芯片贴装和填胶工艺；可有效消除气泡，增加芯片贴装和填胶的粘着力；采用强制热风对流加热，在密闭容器内加压烘烤；烘烤完成后，自动释放压力，并进行冷却。 Representative Pressure/Temp Profiles (User Configurable) 典型压力／温度曲线（可调节）
Fluxless Reflow (Formic Acid) 无助焊剂回流炉（酸性气体炉） Heller Industries has developed fluxless reflow which utilizes Formic Acid（HCOOH）to replace standard flux agents.Formic Acid has been shown to be an effective reducing agent in fluxless solder reflow.It eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.Heller industries can map the formic acid concentration profile and reduce 02 ppm to～-10 ppm for bumping application.Excellent results demonstrated for wafer bumping application and C4 Flip Chip process. Heller的酸性气体炉，使用酸性气体（HC00H）实现无助焊剂焊接；提供实时酸性浓度曲线，氧含量可在10ppm以下，焊接效果优良；优化工艺流程，无需助焊剂涂布工艺，也无需助焊剂清洗工艺。 Features 主要特点 ·Can use any reflow profile（e.g，tent or soak profile）vwith formic acid在酸性气体环境中，满足各类温度曲线要求（如帐篷型曲线或是浸润型曲线） ·Can adjust formic acid profile in oven in conjunction with thermal rellow profile温度曲线和酸性气体浓度曲线均灵活可调 ·Includes Formic acid safety system（i.c，sensors/detectors）adheres to industry standards配备酸性气体防泄露安全系统，符合工业生产安全标准 ·0ffers optional Formic acid abatement systems for Green Process Solution提供酸性气体递减排出功能，绿色环保 ·Ofer optional real time formic acid concentration monitor system提供酸性气体实时浓度监控系统 ·Capable of running both formic acid process and flux process* 可兼顾无助焊剂回流工艺和助焊剂回流工艺（选配） ·SEMI S2-S8 certified符合SEMI S2-S8标准（选配） *Option Heller Fluxless Reflaw Dven 酸性气体炉规格
