Fluxless Reflow (Formic Acid)
无助焊剂回流炉（酸性气体炉）
Heller Industries has developed fluxless reflow which utilizes Formic Acid（HCOOH）to replace standard flux agents.Formic Acid has been shown to be an effective reducing agent in fluxless solder reflow.It eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.Heller industries can map the formic acid concentration profile and reduce 02 ppm to～-10 ppm for bumping application.Excellent results demonstrated for wafer bumping application and C4 Flip Chip process.
Heller的酸性气体炉，使用酸性气体（HC00H）实现无助焊剂焊接；提供实时酸性浓度曲线，氧含量可在10ppm以下，焊接效果优良；优化工艺流程，无需助焊剂涂布工艺，也无需助焊剂清洗工艺。
Features 主要特点
·Can use any reflow profile（e.g，tent or soak profile）vwith formic acid在酸性气体环境中，满足各类温度曲线要求（如帐篷型曲线或是浸润型曲线）
·Can adjust formic acid profile in oven in conjunction with thermal rellow profile温度曲线和酸性气体浓度曲线均灵活可调
·Includes Formic acid safety system（i.c，sensors/detectors）adheres to industry standards配备酸性气体防泄露安全系统，符合工业生产安全标准
·0ffers optional Formic acid abatement systems for Green Process Solution提供酸性气体递减排出功能，绿色环保
·Ofer optional real time formic acid concentration monitor system提供酸性气体实时浓度监控系统
·Capable of running both formic acid process and flux process*
可兼顾无助焊剂回流工艺和助焊剂回流工艺（选配）
·SEMI S2-S8 certified符合SEMI S2-S8标准（选配）
*Option
Heller Fluxless Reflaw Dven
酸性气体炉规格
